| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor cooling apparatus capable of improving the reliability of a semiconductor element by suppressing the rise of temperature of the semiconductor element and of downsizing and making light weight the apparatus by downsizing a condenser. <P>SOLUTION: In the semiconductor cooling apparatus housed in a power conversion apparatus installed below the floor of a railroad vehicle, an electric power conversion circuit corresponding to one phase includes semiconductor elements connected in series, has a DC terminal at opposite ends thereof, and has an AC terminal at an intermediate connection point thereof. The semiconductor elements constituting the upper arm side of the electric power conversion circuit is attached to one face of a heat reception part of one condenser, and the semiconductor elements constituting a lower arm side are attached to one face of a heat reception part of another condenser. The two condensers are arranged vertically. Heat radiators of these condensers are disposed on the body side of an apparatus casing, opened to fresh air with an interval between the upper and lower heat radiators. This ensures fresh traveling wind even on the rear side of a plurality of the condensers to suppress the temperature rise of the semiconductor elements on the rear side. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
