| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition further improved in the properties that the composition can form a protective film and an interlayer dielectric excellent in transparency, heat resistance and flatness, can easily form a uniform film even on a large substrate because of excellent appliability and developability, and has good storage stability, which are desirable properties for a photosensitive resin composition suitable for forming protective films and interlayer dielectrics of electronic components of a liquid crystal display, an integrated circuit device, a solid-state image sensing device, etc., and to provide a pattern forming method using the same. <P>SOLUTION: The photosensitive resin composition comprises at least (a) a copolymer of an unsaturated carboxylic acid or an unsaturated carboxylic acid anhydride and an epoxy-containing polymerizable unsaturated compound, (b) a polymer essentially having a monomeric unit of styrene and/or a styrene derivative and a monomeric unit of an unsaturated organic acid, (c) a quinonediazido-containing compound and (d) an organic solvent, wherein the proportion of a polymer whose composition ratio deviates from the mean value of composition ratio of the polymer (b) by >3% to the polymer (b) is set to ≤20 mass%. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
