| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip resistor for obtaining a fully wide resistor formation region, without generating slit fall, especially secondary slit fall, even in a small chip resistor, and to provide a method for manufacturing the chip resistor. <P>SOLUTION: In a process for manufacturing the chip resistor, resistor paste is printed on the upper surface of a substrate element body, in a strip for printing resistor paste for a plurality of chip resistors when a resistor G12 (a) is formed. After that, slits J1, J2 as grooves are formed by laser scribing (b), then an upper electrode G14 is formed, while striding over the primary slit J1 (c). The upper electrode enters the primary slit J1 formed by laser scribing, so that a side electrode will not come into contact with the resistor, and exfoliation of the side electrode is prevented. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
