| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device, and to increase a manufacturing yield of the same. SOLUTION: The QFN-packaged semiconductor device 1 comprises a sealing resin 2, semiconductor chip 3 encapsulated by the encapsulating resin 2, a plurality of leads 4, a plurality of bonding wires which are encapsulated by the encapsulated resin 2 and electrically connect the plurality of leads 4 and a plurality of electrodes formed on the surface of the semiconductor chip 3, a tab 7 which is a chip-mounting section whereon the semiconductor chip 3 is mounted, suspended leads 8 connected to the tab 7, and islands 9 each provided in respective suspended lead 8. The semiconductor chip 3 and the leads 4 overlap each other, and a part of each lead 4 is located on the lower side of the semiconductor chip 3. The semiconductor chip 3 is bonded not only to the tab 7, but also to the islands 9 via a bonding material. COPYRIGHT: (C)2005,JPO&NCIPI
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