| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem inherent in an electronic component package of the conventional structure that the external connection electrode pad formed on the outside of the bottom adds to the thickness of the package and that the container bottom needs to have a ceramic multilayer structure for forming a conducting path from an electronic element connection electrode pad to an external connection electrode pad, these making the thinning of the container itself difficult. SOLUTION: The electronic component package is constituted of a bottom 11 and a side wall 12 standing upright on the periphery of the bottom 11. A conductive section 11b is formed, which runs from the electronic element connecting electrode pad, formed on the inner side of the main surface of the bottom 11 designed for electronic element installation and enclosed in the side wall 12, to the external connection electrode pad, formed on the outer side of the main surface of the bottom 11, and which includes the two electrode pads. In this package, an insulating section 11a for insulation of the bottom 11 is made of a ceramic material and the conductive section 11b is made of a conductive ceramic alloy, and they are integrated into the bottom 11 of a single-layer structure. COPYRIGHT: (C)2005,JPO&NCIPI
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