| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure capable of reinforcing a second wiring without arranging an insulating member having a high dielectric constant in a space, in which the main surfaces of a first wiring having an air bridge structure and the second wiring (an aerial wiring) are opposed, that is, without extremely increasing a wiring capacity and without extremely increasing processes and a forming method for the wiring structure. SOLUTION: In the wiring structure, the second wiring 3 is formed over the first wiring 2 through the space at the crossed place of the two wirings of the first wiring 2 and the second wiring 3 formed along the surface of a semiconductor substrate 1. Reinforcing supports 101a and 101b composed of a metal for supporting the second wiring 3 are formed on both outsides of the first wiring 2. COPYRIGHT: (C)2005,JPO&NCIPI
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