发明名称 |
Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same |
摘要 |
Disclosed are a multi-layer printed circuit board and a method for manufacturing the multi-layer printed circuit board. Circuit layers and insulating layers are alternately stacked so that via holes of the circuit layers provided with plated inner walls without application of additional plating and conductive paste-filling steps are connected to via holes of the insulating layers filled with a conductive paste.
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申请公布号 |
US2005085065(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20030717977 |
申请日期 |
2003.11.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MOK JEE-SOO;SUN BYUNG-KOOK;SONG CHANG-KYU;YUN GEUM-HEE;KIM TAE-HOON |
分类号 |
H05K3/40;H05K3/46;(IPC1-7):H01L21/476;H05K3/02;H01K3/10;H05K3/20 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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