发明名称 THIN FILM FORMING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To solve the problem that, in the case of a film forming operation for a plurality of semiconductor substrates 3, there is a limitation in an accurate measurement of an aging change of radiation heat by a thermocouple 8 embedded in a susceptor 4 shielded from the radiation heat under the semiconductor substrate 3. SOLUTION: A CVD device 101 comprises a reaction tube 2, the susceptor 4, an infrared lamp 5, a gas inlet 7a for flowing a mixed gas 6 onto the semiconductor substrate 3 and a gas outlet 7b for exhausting the mixed gas 6, the thermocouple 8 which is embedded in a dummy member 102 composed of the same material with the semiconductor substrate 3 on the susceptor 4 near the semiconductor substrate 3, and a heating temperature control unit 9 for controlling the heating output of the infrared lamp 5 on the basis of a measured temperature of the thermocouple 8. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005109098(A) 申请公布日期 2005.04.21
申请号 JP20030339712 申请日期 2003.09.30
申请人 NEC KANSAI LTD 发明人 OKUDA JUNYA
分类号 C23C16/44;C23C16/46;H01L21/205;(IPC1-7):H01L21/205 主分类号 C23C16/44
代理机构 代理人
主权项
地址