发明名称 POWER SUPPLY DEVICE, STRUCTURE, AND HEAT-DISSIPATING ASSEMBLY STRUCTURE OF THE POWER SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power supply device which can be assembled easily. SOLUTION: The power supply device 4 is equipped with a drive circuit board 21, FETs 12, and a pressing plate 23, interposed between the drive circuit board 21 and the FETs 12. The pressing plate 23 is equipped with a plurality of supports 33, a plurality of holders 35, and a plurality of insertion holes 37. The pressing plate 23 is supported by the supports 33 so as to assemble a pressing plate body 31 to the drive circuit board 21, with the body 31 kept separate from the drive circuit board 21. The FETs 12 are assembled to the drive circuit board 21, inserting their connection terminals 16 into fixing holes 45 bored in the drive circuit board 21 through the intermediary of the insertion holes 37; and FET bodies 48 are each pinched between the holding projections 35a and 35b of the holder unit 35, whereby the FETs 12 are held at the pressing plate 23, inserting the connection terminals 16 into the fixing holes 45. The drive circuit board 21 and a heat dissipating plate 27 are fixed together, whereby the FETs 12 are pressed against the heat-dissipating plate 27 by the pressing plate 23 and are coupled to the heat-dissipating plate 27 in heat conductible manner. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005108899(A) 申请公布日期 2005.04.21
申请号 JP20030336414 申请日期 2003.09.26
申请人 AISIN SEIKI CO LTD 发明人 YAMAMOTO KEIICHI
分类号 H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L25/07
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