发明名称 FIXING DEVICE FOR POWER SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a fixing device for a power semiconductor device, with which necessary insulating durability is assured, without using insulating spacer or the like, and breakdown of the semiconductor device due to a surge will not occur. SOLUTION: The fixing device comprises a heat-dissipating fin block 2, an insulating sheet 4 placed between the power semiconductor device 1 and the heat-dissipating fin block 2, and a fixing tool 3, which is formed of an insulating material and is fixed to the heat-dissipating-fin block 2 with a screw 5, to fix the power semiconductor device 1 to the heat-dissipating-fin block 2, wherein a wall part 3b positioned between the screw 5 and the power semiconductor device 1 is formed integrally in the fixing tool 3. Thereby, there is no concern necessary about the insulating distance or the like between the fixing tool 3 and the power semiconductor device 1. Also, even if a thunder surge is accidentally applied to the screw 5, the surge will be cut off by the wall part 3b, and the power semiconductor device 1 will not suffer a breakdown. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005109385(A) 申请公布日期 2005.04.21
申请号 JP20030344137 申请日期 2003.10.02
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAGUCHI SHIGERU;FUKUNISHI TAKAHIRO;NISHINOMIYA MASAFUMI;OKUI HIROSHI
分类号 H05K7/20;H01L23/40;(IPC1-7):H01L23/40 主分类号 H05K7/20
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