发明名称 METHOD FOR ASSEMBLING SUBSTRATE, AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a substrate assembly method and its apparatus for laminating two substrates while ensuring their flatness. SOLUTION: The method for assembling the substrates comprises the processes of: holding an upper substrate 2 with a pressure plate 12 in a vacuum chamber 4; holding a lower substrate 3 on a table 16 so as to make both substrates 2, 3 be opposite to each other; and laminating both substrates 2, 3 to each other with a sealant arranged on at least one substrate 2 by narrowing the gap between both substrates 2, 3 in vacuo. The upper substrate 2 is held with a temporary holder 34 so as to be opposite to the lower substrate 3. Then reduction of the pressure inside the vacuum chamber 4 is started, and subsequently by making the pressure plate 12 be attached to or be brought close to the upper substrate 2 and applying electrostatic attractive force to the pressure plate 12, the upper substrate 2 is mechanically held with the pressure plate 12, the temporary holder 34 is retreated from the upper substrate 2 and both substrates 2, 3 are laminated to each other. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005107143(A) 申请公布日期 2005.04.21
申请号 JP20030340323 申请日期 2003.09.30
申请人 SEIKO EPSON CORP 发明人 MASUDA KENJI
分类号 G02F1/13;G02F1/1339;(IPC1-7):G02F1/133 主分类号 G02F1/13
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