发明名称 FILM FORMATION METHOD USING CHARGED PARTICLE BEAM, SELECTIVE ETCHING METHOD, AND CHARGED PARTICLE BEAM DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a charged particle beam device capable of forming a film in an intended scanning area more effectively than before, with a film formation technology of scanning a converged charged particle beam, and capable of applying a selective etching on an intended scanning area more effectively than before, with a selective etching technology of scanning a converged charged particle beam. SOLUTION: A setting of an optical system as an optimum way of scanning charged particle beam, a beam staying period, and a scanning distance are found against an intended irradiation area for film formation and selective etching, depending on a deposition rate stored in advance or a scanning cycle dependent etching rate, and the result of judgment is displayed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005108472(A) 申请公布日期 2005.04.21
申请号 JP20030336691 申请日期 2003.09.29
申请人 HITACHI LTD;HITACHI HIGH-TECHNOLOGIES CORP 发明人 FUKUDA MUNEYUKI;SHICHI HIROYASU
分类号 C23C14/32;C23C16/00;C23C16/04;C23C16/52;H01J37/30;H01J37/302;H01J37/305;H01J37/317;H01L21/302;(IPC1-7):H01J37/30 主分类号 C23C14/32
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