发明名称 Dielectric memory and method for fabricating the same
摘要 A semiconductor device is provided with an insulating film which is formed on a semiconductor substrate and has a first recess, a capacitor lower electrode which is formed on the walls and the bottom of the first recess and has a second recess, and a capacitor insulating film which is formed on the walls and the bottom of the second recess and has a third recess, and a capacitor upper electrode embedded in the third recess.
申请公布号 US2005082637(A1) 申请公布日期 2005.04.21
申请号 US20040964703 申请日期 2004.10.15
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD 发明人 MIKAWA TAKUMI;FUJII EIJI
分类号 H01L21/02;H01L21/314;H01L21/316;H01L21/768;(IPC1-7):H01L21/824;H01L29/00 主分类号 H01L21/02
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