发明名称 |
Dielectric memory and method for fabricating the same |
摘要 |
A semiconductor device is provided with an insulating film which is formed on a semiconductor substrate and has a first recess, a capacitor lower electrode which is formed on the walls and the bottom of the first recess and has a second recess, and a capacitor insulating film which is formed on the walls and the bottom of the second recess and has a third recess, and a capacitor upper electrode embedded in the third recess.
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申请公布号 |
US2005082637(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20040964703 |
申请日期 |
2004.10.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD |
发明人 |
MIKAWA TAKUMI;FUJII EIJI |
分类号 |
H01L21/02;H01L21/314;H01L21/316;H01L21/768;(IPC1-7):H01L21/824;H01L29/00 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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