| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable organopolysiloxane composition that has a low viscosity with good fillability and has good curability, and can be cured to form a cured product which has a high refractive index, has high light transmission, has high adhesion to a substrate, and is flexible, and to provide a semiconductor device of high reliability. <P>SOLUTION: The curable organopolysiloxane composition comprises (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group in one molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group, and having a siloxane unit represented by the general formula: RSiO<SB>3/2</SB>in one molecule, (C) a linear organopolysiloxane in which both molecular chain ends are blocked with silicon atom-bonding hydrogen atoms, and (D) a hydrosilylation catalyst. Semiconductor elements are coated with the cured product of the composition to provide the semiconductor device. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
