| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device wherein the adhesion between a circuit element and other constituent members is improved. <P>SOLUTION: The circuit device 10A of this configuration comprises a conductive pattern 12, a coating resin 14 covering the conductive pattern 12 except for a first opening 11A, and a semiconductor element 13A electrically connected by a conductive paste 9 to the conductive pattern 12 exposed in the first opening 11A. The first opening 11A is formed to be smaller than the semiconductor element 13A, and the conductive paste 9 contacts with both the conductive pattern 12 exposed in the first opening 11A and with the coating resin 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
