发明名称 |
FLEXIBLE PRINTED BOARD, MOUNTING STRUCTURE, ELECTRO-OPTICAL DEVICE MOUNTED WITH THE MOUNTING STRUCTURE, AND ELECTRONIC APPARATUS MOUNTED WITH THAT ELECTRO-OPTICAL DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed board, capable of preventing continuity failure when a package IC arranged with a plurality of solder balls along the bottom face of the IC is mounted on the flexible printed board, a mounting structure, an electro-optical device mounting that mounting structure, and an electronic apparatus mounting that electro-optical device. SOLUTION: The flexible printed board 10 comprises an auxiliary metal wiring part 14b being led out from the inside direction (edge) of the package IC mounting area A of a land 13a formed at a corner part of the package IC mounting area A and connected with metal wiring 14a (main metal wiring part) at the outside of the package IC mounting area A. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005108994(A) |
申请公布日期 |
2005.04.21 |
申请号 |
JP20030337829 |
申请日期 |
2003.09.29 |
申请人 |
SEIKO EPSON CORP |
发明人 |
IMAZEKI RYOSUKE;ASHIDA TAKESHI;ARIGA YASUHITO |
分类号 |
H05K3/34;H05K1/02;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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