发明名称 |
Stacked package module |
摘要 |
A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. The stud bumps are formed on the back surface. Each stud bump has a bump body and a protruding trail by wire-bonding and cutting. Bumps of another package are bonded on the stub bumps for replacing known intermediate substrate in conventional stacked package module.
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申请公布号 |
US2005082656(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20040934409 |
申请日期 |
2004.09.07 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHU CHI C.;LEE CHENG-YIN;WENG GWO-LIANG;LEE SHIH-CHANG |
分类号 |
H01L25/065;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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