发明名称 Display apparatus having heat dissipating structure for driver integrated circuit
摘要 A display apparatus dissipates heat efficiently from a tape carrier package driver integrated circuit providing an address voltage to a display panel. The display apparatus includes a display panel, a chassis base, a driving circuit, an flexible printed circuit electrically connecting electrodes of the display panel to the driving circuit, and a driver integrated circuit connected through the flexible printed circuit to the display panel, the driver integrated circuit providing a voltage selectively to the electrode of the display panel in accordance with signals controlled by the driving circuit. A thermally conductive medium in liquid-phase or gel-phase is placed between the driver integrated circuit and the chassis base. A pressing plate is placed on the outside of the driver integrated circuit opposite to the chassis base, the pressing plate pressing the driver integrated circuit toward the chassis base for good contact and heat dissipation. A thermally conductive medium is placed between the pressing plate and the driver integrated circuit.
申请公布号 US2005083646(A1) 申请公布日期 2005.04.21
申请号 US20040966241 申请日期 2004.10.15
申请人 BAE SUNG-WON;AHN JOONG-HA;KIM HYOUK 发明人 BAE SUNG-WON;AHN JOONG-HA;KIM HYOUK
分类号 G06F1/16;G06F1/20;H01J17/28;H05K7/20;(IPC1-7):G06F1/16;H05K5/00;H05K7/00;H05K1/14 主分类号 G06F1/16
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