发明名称 ETCHING PROCESS OF SINGLE MASK PT/PCMO/PT STACK TO BE APPLIED TO RRAM
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for dry etching of a Pt/PCMO(Pr<SB>1-x</SB>Ca<SB>x</SB>MnO<SB>3</SB>)/Pt stack. <P>SOLUTION: The method for dry etching of the PCMO stack includes a step in which a substrate is prepared, a step in which a barrier layer is deposited, a step in which an under electrode is deposited, a step in which a PCMO thin film is deposited, a step in which an upper electrode is deposited, a step in which a hard mask layer is deposited, a step in which photoresist is applied to and patterning is carried out, a step in which the hard mask layer is etched, a step in which dry etching carrying out of the upper electrode, a step in which dry etching carrying out of the PCMO layer consisting of plural step etching processes, a step in which dry etching carrying out of the under electrode, and a step in which a device having a PCMO base is completed. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005109446(A) 申请公布日期 2005.04.21
申请号 JP20040247537 申请日期 2004.08.26
申请人 SHARP CORP 发明人 ZHANG FENGYAN;SHIEN TEN SUU
分类号 H01L21/28;G11C13/00;H01L21/02;H01L21/3065;H01L21/311;H01L21/3213;H01L21/8242;H01L27/10;H01L27/108;H01L45/00 主分类号 H01L21/28
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