发明名称 THERMOSETTING RESIN COMPOSITION AND HARDENED FILM
摘要 <P>PROBLEM TO BE SOLVED: To prepare a hardened film excellent in solvent resistance, acid resistance, chemical resistance such as resistance to alkalis, water resistance, thermal resistance, adhesion to substrates such as glass, transparency, scratch resistance, coating property, flatness, resistance to light, and excellent in properties related to foreign matters, and to obtain a thermosetting resin composition giving the hardened film. <P>SOLUTION: The resin composition comprising a polyester amic acid obtained by reacting a tetracarboxylic acid dianhydride, a diamine and a polyhydroxy compound as indispensable components, an epoxy resin, a hardener for the epoxy resin and a solvent, wherein the composition comprises 20-400 pts.wt. of the epoxy resin per 100 pts.wt. of the polyester amic acid, and 15-60 pts.wt. of the epoxy hardener per 100 pts.wt. of the epoxy resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005105264(A) 申请公布日期 2005.04.21
申请号 JP20040261841 申请日期 2004.09.09
申请人 CHISSO CORP 发明人 FUKUMURA TAKANORI;SATO HIROYUKI;ITAMI SETSUO;WATANABE EIJI
分类号 G02B5/20;C08G59/46;G02F1/1335 主分类号 G02B5/20
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