发明名称 SEMICONDUCTOR DEVICE AND ITS FABRICATING PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a good semiconductor device employing one kind of metal in gate electrode of an nMOS and a pMOS, and to provide its fabricating process. SOLUTION: The semiconductor device comprises a semiconductor substrate (101), a gate insulation film (105) composed of a material principally comprising a tetravalent metal oxide, a mixture of a tetravalent metal oxide and SiO<SB>2</SB>, or a mixture of a tetravalent metal oxide and SiON, a gate electrode (115) composed of a metal having a work function of 4-5.5 eV. The gate insulation film contains B when an nMOS structure is formed on the semiconductor substrate, and contains at least one of P and As when a pMOS structure is formed on the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005108875(A) 申请公布日期 2005.04.21
申请号 JP20030335966 申请日期 2003.09.26
申请人 TOSHIBA CORP 发明人 KANEKO AKIO;SEKINE KATSUYUKI;SATO MOTOYUKI;INUMIYA SEIJI;EGUCHI KAZUHIRO
分类号 H01L21/283;H01L21/28;H01L21/316;H01L21/336;H01L21/8238;H01L23/48;H01L27/092;H01L29/423;H01L29/49;H01L29/51;H01L29/78;(IPC1-7):H01L21/823 主分类号 H01L21/283
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