| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaged integrated circuit for installing on a printed wiring board (PWB) or other types of circuit packaging structures, capable of routing high-speed signals from a high-speed lead line at the bottom surface of the packaged integrated circuit. SOLUTION: The packaged integrated circuit comprises a die, and a package body formed of a capsule material that at least partially encloses the die. The lead frame is also connected to the die and partially enclosed in the package body. The lead line extends from the package body, and a sub set of the lead lines is separated at the inter-lead line pitch. At least two adjoining lead lines of the lead frame are separated by the space which is larger than the pitch. An additional lead line is also connected to the die and is arranged on the lower surface of the package. The additional lead line can be connected to a circuit packaging structure trace that runs between the adjoining lead lines separated by the space which is larger than the pitch. COPYRIGHT: (C)2005,JPO&NCIPI
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