| 摘要 |
PROBLEM TO BE SOLVED: To control the distribution of dispersing materials in a plating film with high flexibility in order to improve the film characteristics of dispersion plating. SOLUTION: Striations of a projecting shape or recessed shape are previously imparted to the surface of the article to be plated prior to the conduction of plating. Optional shape patterns, such as a circular shape and a rectilinear shape, can be selected for the striations to be imparted. The article which is imparted with the striations is installed in a plating solution so as to face a counter electrode and the dispersing materials for causing eutectoid in the plating film is contacted to the article and a direct current is caused to flow to an anode and cathode from an external power source in such a manner that the article serves as the cathode and the counter electrode as the anode. At this time, the plating is performed while a magnetic field is applied into the plating solution in the direction parallel to the direction of the current flowing in the plating solution, by which the dispersion plating film is obtained. The dispersion plating film formed by the method has the dispersing materials distributed along the striations of the article and is arrayed with the striations in the thickness direction of the film. COPYRIGHT: (C)2005,JPO&NCIPI
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