| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering material of high joining reliability and excellent in wettability which contains no lead as an environment-harmonized material suitable for mounting/joining electronic components on/with a substrate, and prevents oxidation of zinc. SOLUTION: Non-lead-based joining particles are obtained by selecting either zirconium or molybdenum as additive element to the tin-zinc binary system or the tin-zinc-bismuth ternary system, and excellent joining reliability is ensured by improving the characteristic of zinc-containing solder which is easily oxidized. The non-lead-based joining particles are applicable to a micro electric connection area of an IC package such as BGA (ball grid array) and CSP (chip scale package) used for the surface mounting as joining particles for metallic members. COPYRIGHT: (C)2005,JPO&NCIPI
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