发明名称 |
Apparatus and method for improving coupling across plane discontinuities on circuit boards |
摘要 |
The invention relates to an apparatus and method for improving coupling across plane discontinuities on circuit boards. A circuit board includes a discontinuity, e.g., a split, slot, or cutout, formed on a voltage reference plane. A conductive layer overlies the discontinuity. The conductive layer has a first portion connected to the underlying reference plane and a second portion spanning the discontinuity. The first portion is connected to the reference plane using a slot or vias. And the conductive layer has a third portion extending over the reference plane but remaining disconnected from it. The conductive layer might be graphite or carbon black.
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申请公布号 |
US2005082088(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20040990740 |
申请日期 |
2004.11.16 |
申请人 |
ROTH WESTON;MERSHON JAYNE L.;MOUA XANG;MIX JASON A. |
发明人 |
ROTH WESTON;MERSHON JAYNE L.;MOUA XANG;MIX JASON A. |
分类号 |
H05K1/02;H05K1/16;(IPC1-7):H03H9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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