发明名称 |
Encapsulated stack of dice and support therefor |
摘要 |
Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice. |
申请公布号 |
US2005085034(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20040975839 |
申请日期 |
2004.10.28 |
申请人 |
AKIBA MASAYUKI;ICHIKAWA KINYA;KUBOTA JIRO;KUMAMOTO TAKASHI |
发明人 |
AKIBA MASAYUKI;ICHIKAWA KINYA;KUBOTA JIRO;KUMAMOTO TAKASHI |
分类号 |
H01L21/56;H01L21/8238;H01L21/98;H01L23/31;H01L23/544;H01L25/065;H01L29/74;(IPC1-7):H01L21/823 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|