发明名称 METHOD OF FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist pattern forming method capable of always forming a stable resist pattern, when a liquid immersion exposure device is used. <P>SOLUTION: This resist pattern forming method comprises the steps of forming a resist film (R) on a semiconductor substrate (S) having a work film thereon, exposing the resist film with the liquid immersion exposure device which carries out exposure in a state, where the space between the resist film and an objective lens (1) is filled with a liquid (2), and developing the resist film. The method further comprises the step of forming a resist-protecting film (R1) which is insoluble in the liquid, on the resist film after the formation of the resist film and before the exposure of the resist film. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005109146(A) 申请公布日期 2005.04.21
申请号 JP20030340590 申请日期 2003.09.30
申请人 TOSHIBA CORP 发明人 SHIOBARA HIDESHI
分类号 G03F7/00;G03F7/11;G03F7/16;G03F7/20;G03F7/38;H01L21/027 主分类号 G03F7/00
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