| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the cost of a semiconductor device. <P>SOLUTION: The manufacturing method of a semiconductor device comprises the processes of: forming a plurality of product formation regions, including a circuit and a plurality of first electrode pads on the principal surface of a semiconductor wafer; relocating a plurality of second electrode pads, having a arrangement pitch wider than that of the first electrode pads in the respective product formation regions; making individual pieces turn into the plurality of the product formation regions of the semiconductor wafer, and forming a plurality of the semiconductor devices each including the circuit, the plurality of the first electrode pads, and the plurality of the second electrode pads on the side of the first surface; and removing foreign matters, adhering to the first surface of the semiconductor device, after the process of forming the semiconductor device. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
