| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the adhesiveness between semiconductor chips in a package, in which a plurality of semiconductor chips are laminated for mounting. <P>SOLUTION: A plurality of wiring layers, comprising an interlayer insulating film 405 and wiring 407 made of copper, are laminated, a solder resist layer 408 is formed on the uppermost layer, and a multilayer interconnection structure is composed. On the surface of the multilayer interconnection structure, there are provided first and second elements 410, 430 and a circuit element 440. The first element 410 is bonded to the second one 430 by a bonding layer 411. The upper surface of the first element 410 is set as a plasma treatment surface, and the second element 430 is mounted onto the surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
