发明名称 RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTOLITHOGRAPHIC SPACER AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition capable of forming a cured product having excellent hardness and heat resistance, and useful in various uses, and to provide a photosensitive resin composition using the same, a photosensitive resin composition for a photolithographic spacer and a method for manufacturing the same. <P>SOLUTION: The resin composition contains a material having an aspect ratio of &ge;10 and a thickness of &le;100 nm and a radical-polymerizable monomer and further contains one of the following compounds (1) to (3): (1) binder resin essentially including a monomeric unit formed of a cationic monomer, (2) binder resin essentially including a cationic monomer and a monomeric unit formed of a cationic monomer and/or binder resin not including a monomeric unit formed of a cationic monomer, (3) binder resin essentially including a monomeric unit formed of a cationic monomer and binder resin not including a monomeric unit formed of a cationic monomer. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005106859(A) 申请公布日期 2005.04.21
申请号 JP20030336080 申请日期 2003.09.26
申请人 NIPPON SHOKUBAI CO LTD 发明人 KAHARA KOJI;YOSHIDA MASATOSHI
分类号 G03F7/004;C08F290/00;C08F291/00;G03F7/033;G03F7/038 主分类号 G03F7/004
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