| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam dicing method by which a wafer can be transported easily, even if the wafer thickness is very thin by preventing individual diced chips from being scattered, without using dicing sheets. <P>SOLUTION: In the laser beam dicing method, a reformed region R is formed in at least one wafer W by multiple photon absorption, by holding the wafer between two plate-like things containing a transparent glass plate 81, which is a plate-like item composed of a light-transmissive substance in at least one of them, and making a laser beam transmitted through the glass plate 81 incident to the wafer W. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
