| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for mounting and a manufacturing method of the same, for ensuring highly reliable component mounting without causing faulty mounting upon mounting components. SOLUTION: The circuit substrate for mounting comprises an insulating substrate 1, at least one layer of conduit circuit 5 wired on or/and in the surface of the insulating substrate 1, a bump terminal 2 formed on the surface of land part 5a of the conduit circuit as an integrated object and projected out of the surface 1a of the insulating substrate 1, and a solder terminal 3 formed integrally at the tip end part 2c of the bump terminal 2. COPYRIGHT: (C)2005,JPO&NCIPI
|
