| 摘要 |
PROBLEM TO BE SOLVED: To obtain a curing promoter useful for various curable resin compositions and an epoxy resin composition having excellent curability, preservability and fluidity and to provide a semiconductor device having solder crack resistance and reliability of moisture resistance. SOLUTION: The curing promoter is a curing promoter that is mixed with a curable resin composition to promote the curing reaction of the curable resin composition and is represented by general formula (1) [R<SP>1</SP>-R<SP>3</SP>are each a substituted or nonsubstituted monofunctional aromatic group or a substituted or nonsubstituted monofunctional alkyl group; Ar is a bifunctional aromatic group that is substituted with a substituent group except a hydroxy group or nonsubstituted; A is a (p+1) functional organic group containing an aromatic ring or a heterocyclic ring; a is an integer of≥2; p is an integer of 2-8; q is a value of 0-2]. The epoxy resin composition preferably comprises a compound containing two or more epoxy groups in one molecule, a compound containing two or more phenolic hydroxy groups in one molecule and the curing promoter. COPYRIGHT: (C)2005,JPO&NCIPI
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