| 摘要 |
PROBLEM TO BE SOLVED: To obtain a curable resin composition affording a cured product having a low permittivity, dielectric dissipation factor and hygroscopicity thereof by applying an acetalization reaction to conversion into a higher molecular weight (a three-dimensional crosslinking reaction) and using an industrially practicable method for curing and suitably usable for electrical/electronic applications, or the like, and to provide the method for curing and the cured product thereof. SOLUTION: The curable resin composition comprises a polyhydric hydroxy compound (A), a polyvalent vinyl ether compound (B) and a carboxylic acid (C) having 1.0-5.0 acid dissociation constant pKa in an aqueous solution. The method for curing comprises curing a mixture containing the polyhydric hydroxy compound (A) and the polyvalent vinyl ether compound (B) by using the carboxylic acid (C) having the 1.0-5.0 acid dissociation constant pKa in the aqueous solution as a catalyst. The resultant cured product is provided. COPYRIGHT: (C)2005,JPO&NCIPI
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