| 摘要 |
Disclosed is a semiconductor apparatus including: a first molded resin portion; a plate-shaped lead frame closely attached to the first molded resin portion; a second molded resin portion attached facing the first molded resin portion and the lead frame; and one or more elements attached on the lead frame on a side which faces the second molded resin portion, the one or more elements including a semiconductor element, wherein any part of at least one of the elements does not exist in a region composed of an aggregation of line segments, the line segment being formed by any two points on an outer periphery of the plate-shaped lead frame outside the first and second molded resin portions and all of the line segment being contained inside a board.,of the lead frame.
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