| 发明名称 |
SnAgAu SOLDER BUMP, METHOD OF MANUFACTURING THE SAME, AND METHOD OF BONDING LIGHT-EMITTING ELEMENT EMPLOYING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provided an SnAgAu solder bump, a method of manufacturing the same, and a method of bonding a light-emitting element employing the method of manufacturing the solder bump. <P>SOLUTION: The solder bumps 56a, 58a each composed of a compound containing a first element through a third element are characterized in that the first element and the third element form a compound having a plurality of intermediate phases and solidus lines. The method of manufacturing the solder bumps 56a, 58a and the method of bonding a light-emitting element employing the method of manufacturing the solder bump are disclosed. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005109484(A) |
申请公布日期 |
2005.04.21 |
| 申请号 |
JP20040278887 |
申请日期 |
2004.09.27 |
| 申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHOI WON-KYOUNG;CHAE SU-HEE;KWAK JOON-SEOP |
| 分类号 |
B23K35/00;B23K35/26;H01L21/60;H01L23/485;H01L33/32;H01L33/62;H01S5/022 |
主分类号 |
B23K35/00 |
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