发明名称 RF-ID MEDIUM, AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To further reduce possibility of breakage of an IC chip when external force is applied in a bending direction or external force is intensively applied to the IC chip with respect to an RF-ID medium such as a contactless IC card. <P>SOLUTION: An antenna 112 is formed on a resin sheet 115, the IC chip 111 wherein reading and writing of information are possible in a non-contact state has at least an inlet 110 composed by mounting it on the resin sheet 115 in a state electrically connected to the antenna 112 by a connection terminal 114 provided on the IC chip 111, and reinforcing plates 117a and 117b are adhered to both faces of the IC chip 111 so as to avoid an area provided with the connection terminal 114. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005107881(A) 申请公布日期 2005.04.21
申请号 JP20030340615 申请日期 2003.09.30
申请人 TOPPAN FORMS CO LTD 发明人 SEKIHASHI MASAO
分类号 B42D15/10;G06K19/07;G06K19/077 主分类号 B42D15/10
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