| 摘要 |
<P>PROBLEM TO BE SOLVED: To test the characteristics of a semiconductor package, without using an exclusive socket. <P>SOLUTION: Testing wiring 4 connected with a land 3 is provided on a carrier board 1, and connector 2 is installed integrally with the carrier board 1. The carrier board 1 with mounted semiconductor chips 6 is placed in a burn-in chamber, as it is, and after the semiconductor chip 6 is tested concerning its characteristics, the carrier board 1 provided with the semiconductor chips 6 is divided into pieces. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
