| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem in forming a wiring line using an inkjet method, wherein it is difficult to shrink the width of a wiring line due to spreading of the dots on the wire-forming surface, while a wire line of a narrower width is demanded as progress in semiconductor devices is made, in particular, enhancement in refining and higher aperture ratio of pixels possessed by semiconductor devices. SOLUTION: A surface, on which a wiring line is to be formed, is coated with a photocatalytic substance, represented by TiO2, and the wiring line is formed by utilizing photocatalytic activation of the photocatalytic substance. For example, an electrically conductive substance mixed in a solvent is ejected by an inkjet method on the photocatalytic substance. Thereby, a wiring line, having a width narrower than the diameter of the dots formed by the inkjet method, namely a narrower-width wiring line, can be formed. COPYRIGHT: (C)2005,JPO&NCIPI |
