发明名称 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD AND VACUUM PACK MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method of a printed circuit board capable of easily and certainly perform the setting work of a mold and a sheetlike thermoplastic resin to a hot press including positioning operation in a manufacturing method of a printed circuit board for manufacturing the printed circuit board by superposing a sheetlike thermoplastic resin on a mold to hot-press the same. SOLUTION: The sheetlike thermoplastic resin, on which the mold is superposed, is set to the hot press after the sheetlike thermoplastic resin and the mold are preliminarily fixed to each other. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005103753(A) 申请公布日期 2005.04.21
申请号 JP20030330834 申请日期 2003.09.24
申请人 SINTOKOGIO LTD 发明人 NAKAJIMA SHOGO
分类号 B29C43/02;B29C43/34;B29C43/56;B29L31/34;H05K3/00;(IPC1-7):B29C43/02 主分类号 B29C43/02
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