| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state imaging device which packages a solid state imaging element at a low cost without increasing a step for manufacturing while holding in a thin type as it is, and to provide an imaging apparatus having the same. SOLUTION: The solid state imaging device includes a photodetecting pixel group, a microlens array disposed in a two-dimensional manner corresponding to the photodetecting pixel in a range including at least the photodetecting pixel group, and a transparent member disposed at a light incident side of the microlens array. The solid state imaging device further includes a protrusion formed integrally at a position not superposed with the photodetecting pixel group of a surface side opposed to the microlens array of the transparent member, and the transparent member supported by this protrusion. The imaging apparatus has this solid state imaging device. COPYRIGHT: (C)2005,JPO&NCIPI
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