| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus which can emit the light of a suitable illumination distribution on the front surface of a substrate. SOLUTION: The heat treatment apparatus for heating a disk-like substrate by illuminating with the light includes a light source having a plurality of flash lamps arrayed in a flat surface state along a horizontal surface, a holding means for holding the substrate in a horizontal attitude under the light source, and a deflecting means for deflecting the illumination light from the light source in the radial direction of the substrate held in the holding means. Since the heat treatment apparatus has a recess formed on the upper surface of a first transparent plate 61, the light illuminated from the above light source 5 can be guided down while deflecting the light outward by the first transparent plate 61. Therefore, a difference between the illumination near a center of the light reaching the front surface of a semiconductor wafer W and the illumination near the periphery can be reduced, and the light of the suitable illumination distribution can be illuminated to the front surface of the semiconductor wafer W. COPYRIGHT: (C)2005,JPO&NCIPI
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