| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of the so-called water-repelling of solder which occurs when a chip electronic component is mounted on a circuit board. SOLUTION: The end electrodes of the chip electronic component are formed of base metallic layers formed by baking conductor paste to a chip main body, first metallic layers formed on the base metallic layers, and second metallic layers formed on the first metallic layers and composed of Sn. The first metallic layers are formed to thicknesses that can prevent the gaps held by the base metallic layers from reaching the surfaces of the first metallic layers through the gaps of the first metallic layers. COPYRIGHT: (C)2005,JPO&NCIPI
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