发明名称 PROCESSING LIQUID, AND SUBSTRATE PROCESSING METHOD AND APPARATUS USING PROCESSING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide a processing liquid and a substrate processing method and apparatus using the processing liquid whereby any water mark can be suppressed from being formed on the surface of a low-permittivity material (low-k material). SOLUTION: The processing liquid is the one for processing the substrate wherein a low-permittivity material is exposed to the external at least in a portion of the surface thereof. The processing liquid has at least a hydrophilic group and a hydrophobic group respectively in its one molecule, and includes an organic substance having volatility at a room temperature. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005109362(A) 申请公布日期 2005.04.21
申请号 JP20030343875 申请日期 2003.10.01
申请人 EBARA CORP 发明人 KATAKABE ICHIRO;FUKUNAGA AKIRA;INOUE KATSUTAKA
分类号 C23C18/16;H01L21/304;(IPC1-7):H01L21/304 主分类号 C23C18/16
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