发明名称 |
PROCESSING LIQUID, AND SUBSTRATE PROCESSING METHOD AND APPARATUS USING PROCESSING LIQUID |
摘要 |
PROBLEM TO BE SOLVED: To provide a processing liquid and a substrate processing method and apparatus using the processing liquid whereby any water mark can be suppressed from being formed on the surface of a low-permittivity material (low-k material). SOLUTION: The processing liquid is the one for processing the substrate wherein a low-permittivity material is exposed to the external at least in a portion of the surface thereof. The processing liquid has at least a hydrophilic group and a hydrophobic group respectively in its one molecule, and includes an organic substance having volatility at a room temperature. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005109362(A) |
申请公布日期 |
2005.04.21 |
申请号 |
JP20030343875 |
申请日期 |
2003.10.01 |
申请人 |
EBARA CORP |
发明人 |
KATAKABE ICHIRO;FUKUNAGA AKIRA;INOUE KATSUTAKA |
分类号 |
C23C18/16;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
C23C18/16 |
代理机构 |
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地址 |
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