发明名称 |
Method and apparatus for protecting electronic devices against particulate infiltration, excessive heat build-up, and for implementing EMC shielding |
摘要 |
There is disclosed an apparatus and method for protecting electronic devices against excessive heat build-up and particulate infiltration while implementing EMC shielding.
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申请公布号 |
US2005083649(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20030687472 |
申请日期 |
2003.10.16 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BEHRENS LOUIS E.;BUTTERBAUGH MATTHEW A.;GILLILAND DON A.;HOLAHAN MAURICE F.;PEDERSON PAUL D.JR. |
分类号 |
F25B39/04;G06F1/18;G06F1/20;H05K5/00;H05K9/00;(IPC1-7):H05K5/00 |
主分类号 |
F25B39/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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