发明名称 |
Resin-sealed semiconductor device |
摘要 |
A resin-sealed semiconductor device has a first semiconductor chip whose circuit surface is bonded to a surface of a die pad. The back surface of a second semiconductor chip is bonded to the back surface of the first semiconductor chip. Each of the semiconductor chips is connected by wire to outer lead respectively. A sealing resin is provided for encapsulating the die pad, the first and second semiconductor chips and the wires so that the other surface of the die pad is exposed.
|
申请公布号 |
US2005082689(A1) |
申请公布日期 |
2005.04.21 |
申请号 |
US20040981472 |
申请日期 |
2004.11.05 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
BANDO KOJI;ISHII HIDEKI |
分类号 |
H01L25/18;H01L23/31;H01L23/495;H01L25/065;H01L25/07;(IPC1-7):H01L23/28 |
主分类号 |
H01L25/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|