| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED device wherein the radiation of heat from LEDs mounted on a board is accomplished well for the suppression of temperature rise, and to provide an LED illumination apparatus. <P>SOLUTION: The LED device 3 comprises a plurality of LEDs 8, a board 7 and a copper foil 10 formed on the two surfaces 7a and 7b of the board 7, with the copper foil 10 occupying similar areas of the two surfaces and with the copper foil 10 on the surface 7a formed into circuit patterns 11a and 11b for mounting LEDs 8, and a heatsink 9 arranged to be in contact with the copper foil 10 on the surface 7b of the board 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
