发明名称 |
FILM DEPOSITION SYSTEM, FILM DEPOSITION METHOD, OPTICAL ELEMENT, AND OPTICAL SYSTEM |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film deposition system which can deposit a good thin film on an object for deposition, such as an optical element substrate, hardly receiving a plasma damage and can reduce the light absorption characteristic of the object for deposition. <P>SOLUTION: The sputtering system 1 is the film deposition system for forming the conductive thin film on the surface of the optical element substrate 110 by applying a voltage to a conductive target 2 to thereby generate plasma and depositing the particles of the target vaporized by the plasma to the surface of the optical element substrate 110 thereby reacting the conductive thin film and the reactive gas 3 on the surface of the optical element substrate 110. The system has a chimney unit 114 which orients the plasma generated by the application of the voltage. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005105400(A) |
申请公布日期 |
2005.04.21 |
申请号 |
JP20030344387 |
申请日期 |
2003.10.02 |
申请人 |
CANON INC |
发明人 |
TERANISHI KOJI;SUZUKI YASUYUKI |
分类号 |
G02B1/11;C23C14/00;C23C14/06;C23C14/34;H01J37/32 |
主分类号 |
G02B1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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