| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To arrange an alignment mark for aligning a substrate with a photo mask not to lower the yield of product devices. <P>SOLUTION: For patterning a substrate 1 wherein a plurality of product devices 8 are formed and a resist 5 applied onto the substrate 1 through a photo lithography step, an alignment mark 2 on the substrate side for aligning the resist 5 with a photo mask (not illustrated) for masking is formed within a through hole formation area 6', where a through hole 6 is formed in the substrate 1 in the following step for processing the substrate 1, in a part wherein the product devices 8 of the substrate 1 are formed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
