| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam dicing device that is improved in applicability, such that the device can cope with various processes, such as the formation of a multilayered reformed layer in a wafer, the cutting of a die attaching tape, or the like. <P>SOLUTION: The laser head 20 of the laser beam dicing device 10 is provided with a plurality of laser oscillators 21 and 22, light-condensing means 23 and 23 which individually condense the oscillated laser light beams L1 and L2, and an optical path collecting means 24 which collects the laser light beams L1 and L2 to one optical axis. The laser beam dicing device is constituted to cope with various processes, such as the formation of a multilayered reformed area in a wafer, a composite process by which the formation of the reformed area in the wafer and the cutting of the die attaching tape DT are performed simultaneously, or the like, with the plurality of laser light beams L1 and L2 having converging points P1 and P2 at different positions on the same optical axis. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
